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  • Session 1: Plenary
  • 4.4 Plating Defect Detection and Process Control

    Wednesday May 09, 2018 9:00 AM - Wednesday May 09, 2018 9:20 AM

    Texas Ballroom 1-3

    Electroplating Au interconnect metal on a non-planar process has unique process control challenges.  In this work, we analyze Au plating problems for a non-planar GaAs process for high power applications and demonstrate improved process control.

    4.4 Plating Defect Detection and Process Control